PRODUCT
PRODUCT
Contacts：
Xinxiu Zhu
Tel：
15223848168
Email：
sd02@qunwin.com
QQ：
876843941
Address：
Lidu Park，F(xiàn)uling District，Chongqing，China
PRODUCT
Solder ball is key part of a semiconductor packaging technology like BGA and CSP. Solder ball is technology-intensive product that transmit electric signals by connecting chips and boards.we can supply as small as 50um solder ball, and support custom specifications.
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15223848168
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